Press Release

The Open Compute Project (OCP) Global Summit, a premier event that brings together global experts to discuss the latest innovations in open compute, energy efficiency, storage, networking, and security solutions, will be held from October 15th to 17th at the San Jose Convention Center (SJCC) in San Jose, California.

As the largest server motherboard supplier and a key player in AI server technology, Inventec is committed to contributing its technical expertise to innovate and manufacture products that make the world a better place. Amid the rapidly growing demand for AI servers, racks, and cooling solutions, Inventec will participate as a Diamond Sponsor at this year’s OCP Global Summit, showcasing a broad portfolio of cutting-edge AI servers, racks, and cooling technologies.

At the summit, Inventec will highlight its collaboration with NVIDIA by featuring multiple rack and server solutions. The showcase will include the latest AI rack solution, Artemis, built on the NVIDIA MGX modular platform and powered by the NVIDIA GB200 NVL72 system. This solution, developed with NVIDIA, includes 36 NVIDIA Grace™ CPUs and 72 NVIDIA Blackwell GPUs interconnected via the NVIDIA NVLink® Switch system, designed to support large-scale generative AI training and inference workloads.

Additionally, Inventec will have a 2U AI server based on the NVIDIA MGX architecture on display, powered by the NVIDIA GB200 NVL2, and the 4U AI server P4000G7, which features the NVIDIA NVL16 via the NVIDIA NVLink bridge. Also on display will be the 8U AI server P8000IG6, based on the NVIDIA HGX™ platform, supporting NVIDIA HGX H100/H200/B200 8-GPU architectures, which features NVLink and NVSwitch high-speed, low-latency GPU interconnections. Another standout is the K709G6 server, powered by the NVIDIA Grace CPU Superchip, delivering advanced, energy-efficient performance for demanding AI workloads.

In addition to server innovations, Inventec will introduce its proprietary Lambert Rack immersion cooling solution. This single-node, single-phase immersion cooling system has a total rack thermal design power (TDP) of up to 120KW and supports both silicone oil and hydrocarbon oil, demonstrating Inventec’s commitment to energy-efficient cooling technologies.

Visit Inventec at booth B8 to explore these groundbreaking solutions and connect with our team of experts. Don’t miss this opportunity to experience the future of AI servers and cooling technologies. We look forward to meeting you at the OCP Global Summit 2024.